Saturday, September 27, 2014

The Future of Very Large-Scale Integration (Conti…) - Flexible electronics

 Flexible electronics: Distributed large area (cm2-to-m2) electronic systems based on flexible thin-film-transistor (TFT) technology are drawing much attention due to unique properties such as mechanical conformability, low temperature process ability, large area coverage, and low fabrication costs. Various forms of flexible TFTs can either enable applications that were not achievable using traditional silicon based technology, or surpass them in terms of cost per area. Flexible electronics cannot match the performance of silicon-based ICs due to the low carrier mobility. Instead, this technology is meant to complement them by enabling distributed sensor systems over a large area with moderate performance (less than 1 MHz). Development of inkjet or roll-to-roll printing techniques for flexible TFTs is underway for low-cost manufacturing, making product-level implementations feasible. Despite these encouraging new developments, the low mobility and high sensitivity to processing parameters present major fabrication challenges for realizing flexible electronic systems

Fig.1- Flexible Chip

CMOS scaling is coming to an end, but no single technology has emerged as a clear successor to silicon. The urgent need for post-CMOS alternatives will continue to drive high-risk, high-payoff research on novel device technologies. Replicating silicon’s success might sound like a pipe dream. But with the world’s best and brightest minds at work, we have reasons to be optimistic.